QC/T 1136-2020 English PDF (QCT1136-2020)

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QC/T 1136-2020: Environmental test requirements and test methods of insulated-gate bipolar transistors (IGBT) module for electric vehicles
QC/T 1136-2020
QC
AUTOMOBILE INDUSTRY STANDARD
OF THE PEOPLE’S REPUBLIC OF CHINA
ICS 43.040
T 35
Environmental test requirements and test methods of
insulated-gate bipolar transistors (IGBT) module for
electric vehicles
ISSUED ON: DECEMBER 09, 2020
IMPLEMENTED ON: APRIL 01, 2021
Issued by: Ministry of Industry and Information Technology of PRC
Environmental test requirements and test methods of
insulated-gate bipolar transistors (IGBT) module for
electric vehicles
1 Scope
This document specifies the environmental test requirements and test methods
of insulated-gate bipolar transistors (IGBT) module for electric vehicles.
This document applies to IGBT modules for electric vehicles. Other
semiconductor device modules may use it as a reference.
2 Normative references
The contents of the following documents constitute the indispensable clauses
of this document through normative references in the text. Among them, for
dated reference documents, only the version corresponding to that date is
applicable to this document; for undated reference documents, the latest
version (including all amendments) is applicable to this document.
GB/T 2423.1-2008 Environmental testing for electric and electronic products
- Part 2: Test methods - Tests A: Cold
GB/T 2423.2-2008 Environmental testing for electric and electronic products
- Part 2: Test methods - Tests B: Dry heat
GB/T 2423.5-2019 Environmental testing for electric and electronic products
- Part 2: Test methods - Test Ea and guidance: Shock
GB/T 2423.10-2019 Environmental testing for electric and electronic
products - Part 2: Test methods - Test Fc: Vibration (sinusoidal)
GB/T 2423.22-2012 Environmental testing for electric and electronic
products - Part 2: Test methods Test N: Change of temperature
GB/T 2423.28-2005 Basic environmental testing procedures for electric and
electronic products - Part 2: Test methods - Test T: Soldering
GB/T 2423.56-2018 Environmental testing - Part 2: Test methods - Test Fh:
Vibration, broadband random and guidance
ICES-ini: Collector leakage current before the test.
VGE(th): Threshold voltage between grid-emitter.
VCEsat: Saturation voltage between collector-emitter.
Rth: Thermal resistance.
VF: Forward DC voltage.
IF: Forward DC current.
IC: Collector current.
ton: Turn-on phase time.
toff: Turn-off phase time.
Tcha: Temperature of test chamber.
VCE: Collector-emitter voltage.
VGE: Grid-emitter voltage.
ICN: Nominal current of collector.
USL: Upper limit in specification manual.
LSL: Lower limit in specification manual.
5 Environmental adaptability requirements
5.1 Appearance requirements
The main inspection items and requirements, before test assembly and after
test disassembly, include:
a) The enclosure of the IGBT module is not damaged;
b) The connecting terminals of the IGBT module are not deformed or oxidized;
c) The connection of the IGBT module is reliable;
d) The fasteners of the IGBT module are not loosening.
5.2 Characteristic parameter requirements
The acceptance judgment characteristics, acceptance criteria, measurement
conditions are as shown in Table 1.
shall meet the requirements of 5.1 and 5.2.
5.3.6 High temperature and high humidity blocking
The IGBT module shall be subjected to the high temperature and high humidity
blocking test. The test shall be carried out in accordance with the provisions of
6.7. After the test, it shall meet the requirements of 5.1 and 5.2.
5.3.7 Power cycle
The IGBT module shall be subjected to a power cycle test. The test shall be
carried out in accordance with the provisions of 6.8. After the test, it shall meet
the requirements of 5.1 and 5.2.
5.3.8 Temperature shock
The IGBT module shall be subjected to the temperature shock test. The test
shall be carried out in accordance with the provisions of 6.9. After the test, it
shall meet the requirements of 5.1 and 5.2.
5.3.9 Temperature cycle
The IGBT module shall be subjected to a temperature cycle test. The test shall
be carried out in accordance with the provisions of 6.10. After the test, it shall
meet the requirements of 5.1 and 5.2.
5.3.10 High temperature storage
The IGBT module shall be subjected to high temperature storage test. The test
shall be carried out in accordance with the provisions of 6.11. After the test, it
shall meet the requirements of 5.1 and 5.2.
5.3.11 Low temperature storage
The IGBT module shall be subjected to low temperature storage test. The test
shall be carried out in accordance with the provisions of 6.12. After the test, it
shall meet the requirements of 5.1 and 5.2.
5.3.12 Soldering temperature
The IGBT module shall be subjected to the soldering temperature test. The test
shall be carried out in accordance with the provisions of 6.13. After the test, it
shall meet the requirements of 5.1 and 5.2.
5.3.13 Solderability
The IGBT module shall be subjected to the solderability test. The test shall be
carried out in accordance with the provisions of 6.14. After the test, it shall meet
provisions of GB/T 2423.10. The test procedure is as follows:
a) Number the samples before the test. Follow the requirements of GB/T
29332-2012, to test the characteristic parameters in Table 2 AND record
the data;
b) Select the vibration direction. Fix the sample on the installation fixture,
according to the installation requirements of the data manual;
c) According to the vibration conditions, set the parameters such as vibration
frequency, acceleration, duration;
d) Start the vibrating table. Let the sample start to vibrate in one direction;
e) After the vibration in the first direction is over, change the installation
direction of the sample. Repeat the steps b) ~ d), until the test in the three
directions X, Y, Z is over;
f) Within 24h ~ 48h, follow the requirements of GB/T 29332-2012 to test the
characteristic parameters in Table 2. Organize the report. The
corresponding report record is as shown in Appendix A.
6.3 Random vibration test
6.3.1 Test conditions
The IGBT module shall be subjected to random vibration tests in three
directions X, Y, Z. If there are no special requirements, according to the
installation location, the random vibration severity and test duration of the IGBT
module shall refer to the requirements in GB/T 28046.3-2011.
6.3.2 Test procedure
The random vibration test shall be carried out in accordance with the provisions
of GB/T 2423.56. The test procedure is as follows:
a) Number the samples before the test. Follow the requirements of GB/T
29332-2012, to test the characteristic parameters in Table 1 AND record
the data;
b) Select the impact direction. Fix the sample on the installation fixture;
c) According to random vibration conditions, set the parameters such as
frequency, acceleration, duration;
d) Start the vibrating table. Let the sample start to vibrate randomly in one
direction;
- Voltage: VCE ≥ 0.8 VCES, VGE = 0V;
- Temperature: Tj = Tjop_max;
- Time: ≥ 1000h;
- Termination judgement: 5ICES_ini < ICES < USL.
6.5.2 Test procedure
The high temperature blocking test shall be carried out in accordance with the
provisions of GB/T 29332. The test procedure is as follows:
a) Number the samples before the test. Follow the requirements of GB/T
29332-2012, to test the characteristic parameters in Table 1 AND record
the data;
b) Short-circuit the grid and emitter o...